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Application of Ultraviolet Laser Marking Machine in PCB Chip

时间:2022-11-17     【原创】   阅读

The UV laser marking machine is the best choice for the application of various PCB materials in many industrial fields, from the production of the most basic circuit board, circuit wiring, to the production of pocket embedded chips and other advanced processes. The difference of this material makes the UV laser marking machine the best choice for the application of various PCB materials in many industrial fields, from the production of the most basic circuit board, circuit wiring, to the production of pocket embedded chips and other advanced processes.


The ultraviolet laser marking machine works rapidly when producing circuits, and can etch the surface pattern on the circuit board in a few minutes. This makes UV lasers the fastest way to produce PCB samples. More and more sample laboratories are equipped with internal ultraviolet laser systems.


Depending on the verification of optical instruments, the size of the ultraviolet laser beam can reach 10-20 μ m. To produce flexible circuit traces. The biggest advantage of UV in the production of circuit traces is that circuit traces are extremely small and can only be seen under a microscope.


UV laser marking machine cutting is the best choice for large or small production, and it is also a good choice for PCB disassembly, especially when it needs to be applied to flexible or rigid flexible circuit boards. Disassembly is to remove a single circuit board from the panel. Considering the increasing flexibility of materials, such disassembly will face great challenges.


Mechanical disassembly methods such as V-slot cutting and automatic circuit board cutting are easy to damage sensitive and thin substrates, which brings troubles to electronic manufacturing services (EMS) enterprises when disassembling flexible and rigid flexible circuit boards. The cutting of ultraviolet laser marking machine can not only eliminate the influence of mechanical stress generated in the process of flange processing, deformation and damage of circuit components, but also reduce the influence of thermal stress generated during the disassembly of other lasers such as CO2 laser cutting. The reduction of "cutting buffer" can save space, which means that components can be placed closer to the edge of the circuit, and more circuits can be installed on each circuit board, which will maximize the efficiency and reach the maximum limit of flexible circuit applications.

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